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"Ex situ observations of fast intermetallic growth on the surface of ..."

P. J. Shang et al. (2013)

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DOI: 10.1016/J.MICROREL.2013.02.013

access: closed

type: Journal Article

metadata version: 2022-07-27

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P. J. Shang, L. Zhang, Zhi-Quan Liu, J. Tan, J. K. Shang:
Ex situ observations of fast intermetallic growth on the surface of interfacial region between eutectic SnBi solder and Cu substrate during solid-state aging process. Microelectron. Reliab. 53(6): 899-905 (2013)

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