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"Advantages and new development of direct bonded copper substrates."

Jürgen Schulz-Harder (2003)

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DOI: 10.1016/S0026-2714(02)00343-8

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - https://dblp.org/rec/journals/mr/Schulz-Harder03
Jürgen Schulz-Harder:
Advantages and new development of direct bonded copper substrates. Microelectron. Reliab. 43(3): 359-365 (2003)

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