"Whisker mitigation measures for Sn-plated Cu for different stress tests."

L. Sauter et al. (2010)

> Home

Details and statistics

DOI: 10.1016/J.MICROREL.2010.07.083

access: closed

type: Journal Article

metadata version: 2020-02-22

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/SauterSSKY10
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/SauterSSKY10
L. Sauter, A. Seekamp, Y. Shibata, Y. Kanameda, H. Yamashita:
Whisker mitigation measures for Sn-plated Cu for different stress tests. Microelectron. Reliab. 50(9-11): 1631-1635 (2010)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.