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"Reliability of thermally stressed rigid-flex printed circuit boards for ..."

Abdellah Salahouelhadj et al. (2014)

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DOI: 10.1016/J.MICROREL.2013.08.005

access: closed

type: Journal Article

metadata version: 2024-04-16

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Abdellah Salahouelhadj, Marion Martiny, Sebastien Mercier, Laurent Bodin, David Manteigas, B. Stephan:
Reliability of thermally stressed rigid-flex printed circuit boards for High Density Interconnect applications. Microelectron. Reliab. 54(1): 204-213 (2014)

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