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"Repairing bonding wire connections using a microsoldering unit inside an SEM."

Andreas Rummel et al. (2013)

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DOI: 10.1016/J.MICROREL.2013.07.116

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - https://dblp.org/rec/journals/mr/RummelSKSK13
Andreas Rummel, Klaus Schock, Matthias Kemmler, Andrew Smith, Stephan Kleindiek:
Repairing bonding wire connections using a microsoldering unit inside an SEM. Microelectron. Reliab. 53(9-11): 1427-1429 (2013)

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