"XRD and ToF-SIMS study of intermetallic void formation in Cu-Sn ..."

Glenn Ross et al. (2017)

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DOI: 10.1016/J.MICROREL.2017.07.044

access: closed

type: Journal Article

metadata version: 2021-10-28

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Glenn Ross, Vesa Vuorinen, Michael Krause, S. Reissaus, Matthias Petzold, Mervi Paulasto-Kröckel:
XRD and ToF-SIMS study of intermetallic void formation in Cu-Sn micro-connects. Microelectron. Reliab. 76-77: 390-394 (2017)

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