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"Application of quantitative modal analysis for investigation of thermal ..."

Peyman Rafiee et al. (2013)

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DOI: 10.1016/J.MICROREL.2013.07.028

access: closed

type: Journal Article

metadata version: 2021-12-10

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Peyman Rafiee, Golta Khatibi, N. Nelhiebel, Rainer Pelzer:
Application of quantitative modal analysis for investigation of thermal degradation of microelectronic packages. Microelectron. Reliab. 53(9-11): 1563-1567 (2013)

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