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"Thermomechanical reliability of a silver nano-colloid die attach for high ..."

Pedro Quintero, F. Patrick McCluskey, B. Koene (2014)

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DOI: 10.1016/J.MICROREL.2013.08.002

access: closed

type: Journal Article

metadata version: 2022-08-23

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Pedro Quintero, F. Patrick McCluskey, B. Koene:
Thermomechanical reliability of a silver nano-colloid die attach for high temperature applications. Microelectron. Reliab. 54(1): 220-225 (2014)

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