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"Prediction of the epoxy moulding compound aging effect on package reliability."
Sander Noijen et al. (2010)
- Sander Noijen, Roy Engelen, Joerg Martens, Alexandru Opran, Olaf van der Sluis
, Richard B. R. van Silfhout:
Prediction of the epoxy moulding compound aging effect on package reliability. Microelectron. Reliab. 50(7): 917-922 (2010)
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