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"Large-area die-attachment by silver stress migration bonding for power ..."
Seungjun Noh et al. (2018)
- Seungjun Noh, Hao Zhang, Jeyun Yeom, Chuantong Chen, Caifu Li, Katsuaki Suganuma:
Large-area die-attachment by silver stress migration bonding for power device applications. Microelectron. Reliab. 88-90: 701-706 (2018)
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