"Adhesion strength of die attach film for thin electronic package at ..."

Bruno R. Mose, In-Seo Son, Dong-Kil Shin (2018)

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DOI: 10.1016/J.MICROREL.2018.07.143

access: closed

type: Journal Article

metadata version: 2020-02-22

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Bruno R. Mose, In-Seo Son, Dong-Kil Shin:
Adhesion strength of die attach film for thin electronic package at elevated temperature. Microelectron. Reliab. 91: 15-22 (2018)

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