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"Experimental study on the thermo-mechanical effects of underfill and ..."
Yasuyuki Morita et al. (2006)
- Yasuyuki Morita, Kazuo Arakawa, Mitsugu Todo, Masayuki Kaneto:
Experimental study on the thermo-mechanical effects of underfill and low-CTE substrate in a flip-chip device. Microelectron. Reliab. 46(5-6): 923-929 (2006)
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