"Electromigration degradation mechanism for Pb-free flip-chip micro solder ..."

Toru Miyazaki, Tomoya Omata (2006)

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DOI: 10.1016/J.MICROREL.2006.07.088

access: closed

type: Journal Article

metadata version: 2020-02-22

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Toru Miyazaki, Tomoya Omata:
Electromigration degradation mechanism for Pb-free flip-chip micro solder bumps. Microelectron. Reliab. 46(9-11): 1898-1903 (2006)

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