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"Residual stresses in microelectronics induced by thermoset packaging ..."

Marcel H. H. Meuwissen et al. (2004)

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DOI: 10.1016/J.MICROREL.2004.05.001

access: closed

type: Journal Article

metadata version: 2020-02-22

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Marcel H. H. Meuwissen, Hedzer A. de Boer, Henk L. A. H. Steijvers, Piet J. G. Schreurs, Marc G. D. Geers:
Residual stresses in microelectronics induced by thermoset packaging materials during cure. Microelectron. Reliab. 44(12): 1985-1994 (2004)

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