"Impact of thinning stacked dies on the thermal resistance of bump-bonded ..."

Samson Melamed et al. (2016)

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DOI: 10.1016/J.MICROREL.2016.08.015

access: closed

type: Journal Article

metadata version: 2020-02-22

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Samson Melamed, Naoya Watanabe, Shunsuke Nemoto, Haruo Shimamoto, Katsuya Kikuchi, Masahiro Aoyagi:
Impact of thinning stacked dies on the thermal resistance of bump-bonded three-dimensional integrated circuits. Microelectron. Reliab. 67: 2-8 (2016)

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