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"Electro- and thermomigration induced Cu3Sn and ..."

Lutz Meinshausen et al. (2015)

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DOI: 10.1016/J.MICROREL.2014.09.030

access: closed

type: Journal Article

metadata version: 2020-02-22

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Lutz Meinshausen, Hélène Frémont, Kirsten Weide-Zaage, Bernard Plano:
Electro- and thermomigration induced Cu₃Sn and Cu₆Sn₅ formation in SnAg_3.0Cu_0.5 bumps. Microelectron. Reliab. 55(1): 192-200 (2015)

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