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"Electro- and thermomigration-induced IMC formation in ..."
Lutz Meinshausen et al. (2013)
- Lutz Meinshausen, Hélène Frémont, Kirsten Weide-Zaage, Bernard Plano:
Electro- and thermomigration-induced IMC formation in SnAg3.0Cu0.5 solder joints on nickel gold pads. Microelectron. Reliab. 53(9-11): 1575-1580 (2013)
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