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"Reliability of high temperature solder alternatives."

F. Patrick McCluskey et al. (2006)

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DOI: 10.1016/J.MICROREL.2006.07.090

access: closed

type: Journal Article

metadata version: 2020-02-22

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F. Patrick McCluskey, M. Dash, Z. Wang, D. Huff:
Reliability of high temperature solder alternatives. Microelectron. Reliab. 46(9-11): 1910-1914 (2006)

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