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"Mechanism of pre-annealing effect on electromigration immunity of Al-Cu line."

M. K. Mazumder et al. (2001)

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DOI: 10.1016/S0026-2714(01)00111-1

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - journals/mr/MazumderYMKM01
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  - https://dblp.org/rec/journals/mr/MazumderYMKM01
M. K. Mazumder, S. Yamamoto, H. Maeda, J. Komori, Y. Mashiko:
Mechanism of pre-annealing effect on electromigration immunity of Al-Cu line. Microelectron. Reliab. 41(8): 1259-1264 (2001)

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