"Copper Wire Bonding."

Michael Mayer, Yi-Shao Lai (2011)

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DOI: 10.1016/J.MICROREL.2010.12.004

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type: Journal Article

metadata version: 2020-02-22

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Michael Mayer, Yi-Shao Lai:
Copper Wire Bonding. Microelectron. Reliab. 51(1): 1-2 (2011)

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