"Packaging parameter analysis and optimization design on solder joint ..."

Chao-Yang Mao, Rong-Sheng Chen (2008)

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DOI: 10.1016/J.MICROREL.2007.01.087

access: closed

type: Journal Article

metadata version: 2020-02-22

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Chao-Yang Mao, Rong-Sheng Chen:
Packaging parameter analysis and optimization design on solder joint reliability for twin die stacked packages by variance in strain energy density (SED) of each solder joint. Microelectron. Reliab. 48(1): 119-131 (2008)

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