"Technical challenges of stencil printing technology for ultra fine pitch ..."

Dionysios Manessis et al. (2004)

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DOI: 10.1016/S0026-2714(03)00361-5

access: closed

type: Journal Article

metadata version: 2020-02-22

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Dionysios Manessis, Rainer Patzelt, Andreas Ostmann, Rolf Aschenbrenner, Herbert Reichl:
Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping. Microelectron. Reliab. 44(5): 797-803 (2004)

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