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"Technical challenges of stencil printing technology for ultra fine pitch ..."
Dionysios Manessis et al. (2004)
- Dionysios Manessis, Rainer Patzelt, Andreas Ostmann, Rolf Aschenbrenner, Herbert Reichl:
Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping. Microelectron. Reliab. 44(5): 797-803 (2004)

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