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"Reliability and failure analysis of solder joints in flip chip LEDs via ..."

Julien Magnien et al. (2017)

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DOI: 10.1016/J.MICROREL.2017.07.052

access: closed

type: Journal Article

metadata version: 2022-10-02

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Julien Magnien, Lisa Mitterhuber, Jördis Rosc, Franz Schrank, Stefan Hörth, Lena Goullon, Matthias Hutter, Stefan Defregger, Elke Kraker:
Reliability and failure analysis of solder joints in flip chip LEDs via thermal impedance characterisation. Microelectron. Reliab. 76-77: 601-605 (2017)

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