"The development of effective model for thermal conduction analysis for ..."

He Ma, Daquan Yu, Jun Wang (2014)

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DOI: 10.1016/J.MICROREL.2013.10.003

access: closed

type: Journal Article

metadata version: 2020-02-22

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He Ma, Daquan Yu, Jun Wang:
The development of effective model for thermal conduction analysis for 2.5D packaging using TSV interposer. Microelectron. Reliab. 54(2): 425-434 (2014)

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