"Microstructure evolution of the Sn-Ag-y%Cu interconnect."

Henry Y. Lu, Haluk Balkan, K. Y. Simon Ng (2006)

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DOI: 10.1016/J.MICROREL.2005.08.004

access: closed

type: Journal Article

metadata version: 2020-02-22

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Henry Y. Lu, Haluk Balkan, K. Y. Simon Ng:
Microstructure evolution of the Sn-Ag-y%Cu interconnect. Microelectron. Reliab. 46(7): 1058-1070 (2006)

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