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"Thermal uniformity of packaging multiple light-emitting diodes embedded in ..."
Xingming Long et al. (2013)
- Xingming Long
, Rui-Jin Liao, Jing Zhou, Zhi Zeng:
Thermal uniformity of packaging multiple light-emitting diodes embedded in aluminum-core printed circuit boards. Microelectron. Reliab. 53(4): 544-553 (2013)
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