Stop the war!

Остановите войну!

for scientists:

default search action

combined dblp search
author search
venue search
publication search

ask others

"Electromigration behavior in Cu/Sn-8Zn-3Bi/Cu solder joint."

Lijuan Liu et al. (2010)

> Home

Details and statistics

DOI: 10.1016/J.MICROREL.2009.09.018

access: closed

type: Journal Article

metadata version: 2020-02-22

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/LiuZZLW10
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/LiuZZLW10
Lijuan Liu, Wei Zhou, Hongbo Zhang, Baoling Li, Ping Wu:
Electromigration behavior in Cu/Sn-8Zn-3Bi/Cu solder joint. Microelectron. Reliab. 50(2): 251-257 (2010)

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.