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"Location resolved transient thermal analysis to investigate crack growth ..."

E. Liu et al. (2017)

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DOI: 10.1016/J.MICROREL.2017.06.014

access: closed

type: Journal Article

metadata version: 2023-09-30

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E. Liu, Thomas Zahner, Sebastian Besold, Bernhard Wunderle, Gordon Elger:
Location resolved transient thermal analysis to investigate crack growth in solder joints. Microelectron. Reliab. 79: 533-546 (2017)

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