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"Random vibration reliability of BGA lead-free solder joint."

Fang Liu, Guang Meng (2014)

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DOI: 10.1016/J.MICROREL.2013.08.020

access: closed

type: Journal Article

metadata version: 2020-02-22

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Fang Liu, Guang Meng:
Random vibration reliability of BGA lead-free solder joint. Microelectron. Reliab. 54(1): 226-232 (2014)

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