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"Alloying modification of Sn-Ag-Cu solders by manganese and titanium."

Li-Wei Lin et al. (2009)

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DOI: 10.1016/J.MICROREL.2008.10.001

access: closed

type: Journal Article

metadata version: 2020-02-22

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Li-Wei Lin, Jenn-Ming Song, Yi-Shao Lai, Ying-Ta Chiu, Ning-Cheng Lee, Jun-Yen Uan:
Alloying modification of Sn-Ag-Cu solders by manganese and titanium. Microelectron. Reliab. 49(3): 235-241 (2009)

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