"Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding ..."

Adeline B. Y. Lim et al. (2014)

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DOI: 10.1016/J.MICROREL.2014.05.005

access: closed

type: Journal Article

metadata version: 2020-02-22

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Adeline B. Y. Lim, Andrew C. K. Chang, Oranna Yauw, Bob Chylak, Chee Lip Gan, Zhong Chen:
Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters. Microelectron. Reliab. 54(11): 2555-2563 (2014)

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