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"Stress analysis of Cu/low-k interconnect structure during whole Cu-CMP ..."

Chenglong Liao et al. (2013)

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DOI: 10.1016/J.MICROREL.2013.01.011

access: closed

type: Journal Article

metadata version: 2020-10-26

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Chenglong Liao, Dan Guo, Shizhu Wen, Xinchun Lu, Jianbin Luo:
Stress analysis of Cu/low-k interconnect structure during whole Cu-CMP process using finite element method. Microelectron. Reliab. 53(5): 767-773 (2013)

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