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"Stress analysis of Cu/low-k interconnect structure during whole Cu-CMP ..."
Chenglong Liao et al. (2013)
- Chenglong Liao, Dan Guo, Shizhu Wen, Xinchun Lu, Jianbin Luo:
Stress analysis of Cu/low-k interconnect structure during whole Cu-CMP process using finite element method. Microelectron. Reliab. 53(5): 767-773 (2013)
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