Stop the war!
Остановите войну!
for scientists:
default search action
"Finite element analysis of the effect of process-induced voids on the ..."
Van Nhat Le et al. (2016)
- Van Nhat Le, Lahouari Benabou, Victor Etgens, Quang Bang Tao:
Finite element analysis of the effect of process-induced voids on the fatigue lifetime of a lead-free solder joint under thermal cycling. Microelectron. Reliab. 65: 243-254 (2016)
manage site settings
To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.