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"Effect of Ag, Fe, Au and Ni on the growth kinetics of Sn-Cu intermetallic ..."
Tomi Laurila et al. (2009)
- Tomi Laurila
, J. Hurtig, Vesa Vuorinen
, Jorma K. Kivilahti:
Effect of Ag, Fe, Au and Ni on the growth kinetics of Sn-Cu intermetallic compound layers. Microelectron. Reliab. 49(3): 242-247 (2009)
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