"Effects of TSVs (through-silicon vias) on thermal performances of 3D IC ..."

John H. Lau, Tang Gong Yue (2012)

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DOI: 10.1016/J.MICROREL.2012.04.002

access: closed

type: Journal Article

metadata version: 2020-02-22

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John H. Lau, Tang Gong Yue:
Effects of TSVs (through-silicon vias) on thermal performances of 3D IC integration system-in-package (SiP). Microelectron. Reliab. 52(11): 2660-2669 (2012)

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