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"Effects of TSVs (through-silicon vias) on thermal performances of 3D IC ..."
John H. Lau, Tang Gong Yue (2012)
- John H. Lau, Tang Gong Yue:
Effects of TSVs (through-silicon vias) on thermal performances of 3D IC integration system-in-package (SiP). Microelectron. Reliab. 52(11): 2660-2669 (2012)
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