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"Electrical behavior of Au-Ge eutectic solder under aging for solder bump ..."

F. L. Lau et al. (2013)

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DOI: 10.1016/J.MICROREL.2013.07.081

access: closed

type: Journal Article

metadata version: 2022-09-24

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F. L. Lau, Riko I. Made, Wahyuaji Narottama Putra, J. Z. Lim, V. C. Nachiappan, J. L. Aw, Chee Lip Gan:
Electrical behavior of Au-Ge eutectic solder under aging for solder bump application in high temperature Electronics. Microelectron. Reliab. 53(9-11): 1581-1586 (2013)

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