"Development of a novel stack package to fabricate high density memory ..."

Chinguo Kuo, Jen-Jun Chen (2010)

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DOI: 10.1016/J.MICROREL.2010.04.025

access: closed

type: Journal Article

metadata version: 2020-02-22

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Chinguo Kuo, Jen-Jun Chen:
Development of a novel stack package to fabricate high density memory modules for high-end application. Microelectron. Reliab. 50(8): 1116-1120 (2010)

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