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"Heat and mass transfer effects of laser soldering on growth behavior of ..."

Anil Kunwar et al. (2018)

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DOI: 10.1016/J.MICROREL.2017.11.016

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - https://dblp.org/rec/journals/mr/KunwarSRWGCMSZ18
Anil Kunwar, Shengyan Shang, Peter Råback, Yunpeng Wang, Julien Givernaud, Jun Chen, Haitao Ma, Xueguan Song, Ning Zhao:
Heat and mass transfer effects of laser soldering on growth behavior of interfacial intermetallic compounds in Sn/Cu and Sn-3.5Ag0.5/Cu joints. Microelectron. Reliab. 80: 55-67 (2018)

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