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"Finite element simulation of package stress in transfer molded MEMS ..."

Rudolf Krondorfer et al. (2004)

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DOI: 10.1016/J.MICROREL.2004.05.020

access: closed

type: Journal Article

metadata version: 2020-02-22

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Rudolf Krondorfer, Yeong K. Kim, Jaeok Kim, Claes-Gøran Gustafson, Timothy C. Lommasson:
Finite element simulation of package stress in transfer molded MEMS pressure sensors. Microelectron. Reliab. 44(12): 1995-2002 (2004)

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