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"Improved thermal management of low voltage power devices with optimized ..."

Helmut Köck et al. (2011)

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DOI: 10.1016/J.MICROREL.2011.06.052

access: closed

type: Journal Article

metadata version: 2020-02-22

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Helmut Köck, Christian Djelassi, Stefano de Filippis, Robert Illing, Michael Nelhiebel, Markus Ladurner, Michael Glavanovics, Dionyz Pogany:
Improved thermal management of low voltage power devices with optimized bond wire positions. Microelectron. Reliab. 51(9-11): 1913-1918 (2011)

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