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"Low temperature bonding technology for 3D integration."

Cheng-Ta Ko, Kuan-Neng Chen (2012)

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DOI: 10.1016/J.MICROREL.2011.03.038

access: closed

type: Journal Article

metadata version: 2020-02-22

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Cheng-Ta Ko, Kuan-Neng Chen:
Low temperature bonding technology for 3D integration. Microelectron. Reliab. 52(2): 302-311 (2012)

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