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"Conductive adhesives for through holes and blind vias metallization."

Ryszard Kisiel et al. (2005)

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DOI: 10.1016/J.MICROREL.2005.03.005

access: closed

type: Journal Article

metadata version: 2021-10-14

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  - https://dblp.org/rec/journals/mr/KisielBKF05
Ryszard Kisiel, Janusz Borecki, Grazyna Koziol, Jan Felba:
Conductive adhesives for through holes and blind vias metallization. Microelectron. Reliab. 45(12): 1935-1940 (2005)

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