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"Finite volume based CFD simulation of pressurized flip-chip underfill ..."

C. Y. Khor et al. (2010)

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DOI: 10.1016/J.MICROREL.2009.08.007

access: closed

type: Journal Article

metadata version: 2020-02-22

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C. Y. Khor, M. Abdul Mujeebu, Mohd Zulkifly Abdullah, F. Che Ani:
Finite volume based CFD simulation of pressurized flip-chip underfill encapsulation process. Microelectron. Reliab. 50(1): 98-105 (2010)

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