"Reliability of micro-interconnects in 3D IC packages."

C. Robert Kao et al. (2013)

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DOI: 10.1016/J.MICROREL.2012.11.005

access: closed

type: Journal Article

metadata version: 2020-02-22

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C. Robert Kao, Albert T. Wu, King-Ning Tu, Yi-Shao Lai:
Reliability of micro-interconnects in 3D IC packages. Microelectron. Reliab. 53(1): 1 (2013)

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