"Quantitative evaluation of bending reliability for a flexible near-field ..."

J.-H. Jeong, J.-H. Kim, Chung-Seog Oh (2017)

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DOI: 10.1016/J.MICROREL.2017.06.030

access: closed

type: Journal Article

metadata version: 2024-04-10

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J.-H. Jeong, J.-H. Kim, Chung-Seog Oh:
Quantitative evaluation of bending reliability for a flexible near-field communication tag. Microelectron. Reliab. 75: 121-126 (2017)

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