"Stress intensities at the triple junction of a multilevel thin film package."

Insu Jeon, Ki-Ju Kang, Seyoung Im (2008)

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DOI: 10.1016/J.MICROREL.2007.12.004

access: closed

type: Journal Article

metadata version: 2020-02-22

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Insu Jeon, Ki-Ju Kang, Seyoung Im:
Stress intensities at the triple junction of a multilevel thin film package. Microelectron. Reliab. 48(5): 749-756 (2008)

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