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"Electromigration on void formation of Sn3Ag1.5Cu FCBGA solder joints."
Ming-Hwa R. Jen, Lee-Cheng Liu, Yi-Shao Lai (2009)
- Ming-Hwa R. Jen, Lee-Cheng Liu, Yi-Shao Lai:
Electromigration on void formation of Sn3Ag1.5Cu FCBGA solder joints. Microelectron. Reliab. 49(7): 734-745 (2009)
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