"Impact of aluminum wire and ribbon bonding technologies on ..."

Sébastien Jacques, R. Leroy, Marc Lethiecq (2015)

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DOI: 10.1016/J.MICROREL.2015.06.012

access: closed

type: Journal Article

metadata version: 2021-10-14

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Sébastien Jacques, R. Leroy, Marc Lethiecq:
Impact of aluminum wire and ribbon bonding technologies on D²PAK package reliability during thermal cycling applications. Microelectron. Reliab. 55(9-10): 1821-1825 (2015)

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