"Effect of microwave preheating on the bonding performance of flip chip on ..."

Rashed Adnan Islam, Y. C. Chan (2004)

> Home

Details and statistics

DOI: 10.1016/J.MICROREL.2003.08.014

access: closed

type: Journal Article

metadata version: 2022-10-02

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/IslamC04
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/IslamC04
Rashed Adnan Islam, Y. C. Chan:
Effect of microwave preheating on the bonding performance of flip chip on flex joint. Microelectron. Reliab. 44(5): 815-821 (2004)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.