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"Thermal cycle reliability of Cu-nanoparticle joint."

Toshitaka Ishizaki, Masanori Usui, Y. Yamada (2015)

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DOI: 10.1016/J.MICROREL.2015.07.039

access: closed

type: Journal Article

metadata version: 2022-04-01

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Toshitaka Ishizaki, Masanori Usui, Y. Yamada:
Thermal cycle reliability of Cu-nanoparticle joint. Microelectron. Reliab. 55(9-10): 1861-1866 (2015)

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